What is the technology of aluminum substrate besides exposure?
addDate:2018-07-04 From:YiLiHua Keywords:YiLiHua Views:1533
In addition to exposure and screen printing, the difference between the two processes is:
1. The exposure process transfers the image on the original film to the photosensitive substrate (i.e. PCB board) by the action of light source.
The ink used for exposure is photosensitive ink, which is produced in a dust-free workshop. Because to ensure that the ink on the board without any garbage and granular, ink thickness to 15UM to 20UM, this can ensure that the board ink over 280 degrees does not yellowing, the return rate of more than 90%, which produces a photosensitive process cost and efficiency problems, so PCB high price. For example, some 4MM board width and 0.2 line width line spacing require high precision screen printing process can not meet this requirement.
2. Screen printing process is to print the component shape, serial number and other descriptive words on the component surface or solder surface through screen printing, so as to facilitate the production process of PCB plug-ins (including the surface packaging components of the patch) and future product maintenance operations.
Silk screen printing with light-solid/thermoset ink, can be produced in a room at will, but can not guarantee the smooth surface of the board itself, ink thickness and other requirements, if it is white for a long time, it is easy to appear yellowing and other phenomena, can not reach the required return rate.
And as in some precision can not meet the requirements, such as a 3014 beads pad, and made with silk printing process, the pad will be easy to shrink a lot, pad edges like jagged uneven, so it is easy to cause brushing solder paste and paste beads difficulty.
1. The exposure process transfers the image on the original film to the photosensitive substrate (i.e. PCB board) by the action of light source.
The ink used for exposure is photosensitive ink, which is produced in a dust-free workshop. Because to ensure that the ink on the board without any garbage and granular, ink thickness to 15UM to 20UM, this can ensure that the board ink over 280 degrees does not yellowing, the return rate of more than 90%, which produces a photosensitive process cost and efficiency problems, so PCB high price. For example, some 4MM board width and 0.2 line width line spacing require high precision screen printing process can not meet this requirement.
2. Screen printing process is to print the component shape, serial number and other descriptive words on the component surface or solder surface through screen printing, so as to facilitate the production process of PCB plug-ins (including the surface packaging components of the patch) and future product maintenance operations.
Silk screen printing with light-solid/thermoset ink, can be produced in a room at will, but can not guarantee the smooth surface of the board itself, ink thickness and other requirements, if it is white for a long time, it is easy to appear yellowing and other phenomena, can not reach the required return rate.
And as in some precision can not meet the requirements, such as a 3014 beads pad, and made with silk printing process, the pad will be easy to shrink a lot, pad edges like jagged uneven, so it is easy to cause brushing solder paste and paste beads difficulty.
